HY880 -5.15 W/MK 1g High Performance Thermal Compound Paste
Sku
HY880

Beschikbaarheid: In voorraad

US$ 2,00
OF

Cool Down Quickly
Super carbon nano-grade super thermal conductive silicone grease. Thermal conductivity 5.15 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.


Easy To Apply
It has proper viscosity and density is simple and convenient to use and has good consistency whether it is applied by beginners or even with fingers.And it has excellent performance and can continue to maintain good thermal conductivity.


Widely Used
Computer Freezes, Blue Screens, Game Lag, computer automatic shutdown and restart, etc., to a large extent, are caused by excessive data processing by the CPU processor, CPU temperature rise, and fan speed increase. The use of silicone grease with high thermal conductivity can cool the temperature and delay processor aging.



  • ✔【Better Than Liquid Metal】Super carbon nano-grade super thermal conductive silicone grease. Thermal conductivity 5.15 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.

  • ✔【Safe For You And Your PC】Strong insulation performance, withstand voltage above 10,000 volts.

  • ✔【Easy to Use】Thermal paste has ideal consistency and is very easy to use even for beginners.

  • ✔【High Durability】Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost performance. It will not compromise over time.

  • ✔【Safety Application】Suitable for CPU radiator or chip. High-temperature resistance, low thermal resistance, and high conductivity can achieve excellent heat transfer. Suitable for CPU, VGA, chipset, and other PC components.

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Details

Feature

  • Features optimum thermal conductivity and low thermal resistance.
  • Simple to use. Transfer the dissipated heat from the components to the heat sink.
  • The texture is thin enough to spread on components with fingers without creating much mess.
  • Can be applied for cooling the interface of heatsink and CPU GPU IC Chips Transistors, etc
  • Thermal Conductivity: 5.15 W/mK Size: 5.28in × 0.35in/13.4cm × 0.9cm
  • Weight: 1 G/pcs
  • Thermal Impedance: <0.004*C-IN2/W
  • Viscosity: 12500
  • Concentration: 330±101/10MM
  • Instantaneous Temperature:'-50~340°C
  • Working Temperature:'-30~280C
  • Silicon Compound: 10%
  • Carbon Compound: 45%
  • Oxidized Metal Compound: 45%

Package Included

  • 1 x Thermal Paste(1pc =1g)

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